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Data Sheet
SML-Z1 series
.WASHING
Please note the following points when washing is required after soldering.
5-1) WASHING SOLVENT
sopropyl alcohol or other alcohol solvent is recommendable.
5-2) TEMPERATURE
Below 30篊, immersion time ; within 3 minutes.
5-3) ULTRA SONIC WASHING
Below 15/1 litter of solvent tub.
54) COOLING
Below 100篊 within 3 minutes.
.EROSION GAS
tilization in erosion gas atmosphere may degenerate the plating surface which might cause deterioration of
solder strength, optical characteristics, or functions.
Please take precautions against occurrence of gas from the surrounding parts on the occasion of custody,
and also after mounted on circuit board.
.STORAGE
At reflow soldering, the reliability of this product is often influenced by moisture
absorption so we apply the packaging with moisture proof for better condition is use, please also note that
7-1) Not to be opened before using.
7-2) To be kept in our moisture proof packaging with some desiccant (SILICA GEL) after opening it.
     To be baked in case the SILICA GEL indicator changed its color from either blue to clear or green to pink.
-3) Please use within 72 hours after the package was opened. (Condition at 30篊, max.70%Rh.)
     In case it is not used within 72 hours, please put it back into our packaging.
7-4) BAKING
     Please bake under reel condition at 60篊 40^48 hours max.20%Rh after un-sealin .
     While baking is done, the reel and emboss tape may be easily deformed.
Please be careful not to give any stress.
.LIFE TIME
This product will cause reduction of luminous intensity depending on the using conditions and environmental.
Please inquire our sales contact if long life time is required on your application.
10/10
 2013.08 - Rev.C
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